ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/ECCOBOND E3200電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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ECCOBOND E3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity Brookfield, map (cap)10 rpm,150,000Sag Resistance, inches 0.5Specific Gravity 1.15Shelf Life @ -18°C, days 90Flash Point - See
MSDSTYPICAL CURING PERFORMANCE Cure Schedule-20 minutes @ 100°C or10 minutes @ 110°C or5 minutes @ 120°CThe above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness, Shore D 78Temperature Range of Use, °C -25 to 100StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.Optimal Storage: -18 °C
ECCOBOND E3200被設計為化學耐受，快速和低溫熱固化粘合劑，用于粘合不相似的工程基材。
固化材料的特性粘度Brookfield，mPa（cap）10 rpm，150,000抗鋸齒度，英寸0.5特殊重力1.15Shelf壽命@ -18° C，90天閃點 - 參見MSDSTYPICAL CURING PERFORMANCECURE Schedule-20 minutes @ 100°C or10分鐘@ 110°C或5分鐘@ 120°CT以上治療方案是指導性建議。
治愈條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗和應用要求以及客戶固化設備，烤箱裝載和實際溫度而有所不同。
固化材料的典型特性物理性能：硬度，肖氏D 78使用溫度范圍°C -25至100儲存在未開封容器中的產(chǎn)品在干燥的位置。存儲信息可能在產(chǎn)品容器標簽上顯示。
*佳儲存：-18° |
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