TRA-BOND 2104樂泰膠水, 環氧樹脂膠
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TRA-BOND 2104是推薦用于關鍵電子，航空航天和工業粘合，層壓和增強應用的觸變環氧樹脂系統，需要具有高填充，無凹陷特性的粘合劑。 這種兩部分無溶劑的粘合劑易于混合，用于將部件加工到印刷電路板上，以提高機械剛度，以及用于金屬，玻璃，陶瓷，木材和許多塑料的粘合，層壓和修復應用。 TRA-BOND 2104硬化到堅韌的搪瓷涂層，具有良好的耐化學性以及優異的物理和機械性能。 固化的粘合劑提供良好的電絕緣性和耐候性，電動作用，石油產品和潤滑劑，醇，鹽，弱酸和堿以及其他有機和無機化合物。
TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. This two-part, solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. TRA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds |
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