ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
ABLETHERM 3185樂泰膠水, 芯片膠
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ABLETHERM 3185粘合劑設計用于熱 增強倒裝芯片BGA應用。 這銀色 Sycar粘合劑表現出高熱和電 電導率。 材料的低模量使它 適用于將IC連接到集成散熱器中 層壓FCBGA應用治療過程數據 3185 推薦治療條件 60分鐘@175žC 替代治療條件 60分鐘@ 100％C @ 60分鐘@ 175℃ 儲存壽命@40 o C 6個月
ABLETHERM 3185 Adhesive Designed for Thermal Enhanced Flip Chip BGA Applications. This silver Sycar adhesive exhibits high heat and electrical conductivity. Low modulus of the material makes it suitable for connecting ICs to integrated heat sinks. FCBGA Application Process Data 3185 Recommended Treatment Conditions 60 min @ 175 zC Alternative Treatment Condition 60 min @ 100% C @ 60 min @ 175 ° C Storage Life @ 40 O C 6 month |
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