HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/HYSOL FP4450電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
Hysol® FP4450 is high purity, low stress liquid encapsulantwith good moisture resistance and an extended working life. Itis designed for protection of bare semiconductor devices.Pressure pot performance on live devices is up to 500 hourswith no failures, depending upon device and package type.
This material is designed for temperature cycling ranges up to
-65°C to 150°C. Pot life or working life has been extended to
approximately 3 days. This liquid epoxy exhibits relatively high
flow. A cavity or a potting dam is required for flow control.
Hysol® FP4450 may be suitable for bare chip protection in a
variety of advanced packages such as IC memory cards, chip
carriers, hybrid circuits, chip-on-board, multi-chip modules, ball
grid arrays and pin grid arrays. The high temperature
performance and excellent resistance to chemicals, moisture
and handling damage, are also advantageous for automotive
applications.
Extractable Ionic Content (ITM107B)
Chloride (Cl-), ppm 5
Sodium (Na+), ppm 1
Potassium (K+), ppm 2
Handling
Pot Life @ 25°C, 77°F, days, 3
(200 gram mass ),(ITM10T),
Gel Time @ 121°C, (250°F), minutes 12
產品描述
Hysol®FP4450是高純度，低應力液體密封劑
具有良好的耐濕性和延長的使用壽命。它
被設計用于保護裸半導體器件。
現場設備的壓力罐性能可達500小時
沒有故障，取決于設備和包裝類型。
該材料專為溫度循環范圍而設計
-65℃至150℃。使用壽命或工作壽命延長至
約3天。該液體環氧樹脂顯示較高
流。流量控制需要一個空腔或灌封壩。
Hysol®FP4450可能適用 |
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