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技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
樂泰 3536 epoxy reworkable underfill is designed to
provide protection for solder joints against mechanical stress
such as shock, drop and vibration.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP52, 25 °C, mPa•s (cP):
Speed 20 rpm 18,000
Pot Life @ 25oC, days >14
Shelf Life @ 2 to 8°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
5 minutes @ 120°C
2 minutes @ 130°C
Curing above 140°C is not recommended.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
樂泰 3536環(huán)氧樹脂可再加工底層填料設(shè)計(jì)
提供針對機(jī)械應(yīng)力的焊點(diǎn)保護(hù)
如震動,跌落和振動。
固化材料的典型特性
粘度,Brookfield CP52,25℃,mPa•s(cP):
速度20轉(zhuǎn)18,000
天氣25℃,天> 14
保質(zhì)期2至8°C,365天
閃點(diǎn) - 見SDS
典型的固化性能
推薦治療時間表
在120°C下5分鐘
在130°C下2分鐘
不建議在140°C以上固化。
以上治療方案是指導(dǎo)性建議。治愈
條件(時間和溫度)可能會根據(jù)客戶的 |