ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/ECCOBOND E8502-1電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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ECCOBOND E8502-1 is a solventless modified epoxyadhesive that combines low stress with good adhesion onnearly all surfaces and is flexible for mismatched CTEapplications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP):
Speed 10 rpm, # 6 40,000 to 50,000
Specific Gravity 1.15 to 1.2
Shelf Life @ -25 to -18°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
90 minutes @ 120°C or
60 minutes @ 150°C or
15 minutes @ 175°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C
ECCOBOND E8502-1是一種無溶劑改性環(huán)氧粘合劑，在低于所有表面的情況下結(jié)合了低應(yīng)力和良好的粘附力，并且對于錯配的CTE應(yīng)用是靈活的。
固化材料的典型特性
粘度，Brookfield，25°C，mPa•s（cP）：
速度10 rpm，＃6 40,000到50,000
比重1.15〜1.2
保質(zhì)期@ -25至-18°C，月6
閃點 - 參見MSDS
典型的固化性能
治愈時間表
120分鐘或90分鐘
在150°C或60分鐘
175°C 15分鐘
以上治療方案是指導(dǎo)性建議。保養(yǎng)條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗和應(yīng)用要 |
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