HYSOL GR869電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
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GR869 is a green semiconductor grade molding compoundespecially designed for SOIC, TSOP and QFP packages withNi/Pd and copper leadframes. It offers much improved JEDEC
performance as well as moldability property.GR869 meets UL 94 V-0 Flammability at 3.175mm thickness.TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 28
Spiral Flow, @ 175°C, inches 43Shelf Life:@ 5oC, months 6Hot Hardness,Shore-D@ 175°C, 90 seconds 80TYPICAL PROCESS DATAHandlingPreheat Temperature , °C 80 to 90Molding Temperature, °C 170 to 190Transfer Pressure, Kgf/cm2 40 to 85Transfer Time, seconds 5 to 10
Curing Time, 3 mm section:Conventional mold:@ 175oC, seconds 60 to 90Automold:@ 175oC, seconds 50 to 90Post Cure @ 175°C, hours 2 to 6GR869 has been formulated to provide the best possiblemoldability and as wide a molding latitude as possible.Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown above
StorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Powder Storage - Powder or preforms should be stored at -4oCor below, in closed containers. After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisturecontamination. The suggested waiting time for a standard 15kg carton box is 24 hours.
GR869是一種綠色半導體級成型復合材料，專為SOIC，TSOP和QFP封裝設計，具有N / Pd和銅引線框架。它提供了大大改進的JEDEC
性能以及成型性能.GR869符合UL 94 V-0厚度3.175mm的可燃性。固化材料的特性特性時間@ 175°C，秒28螺旋流量，@ 175°C，英寸43Shelf壽命：@5oC，月份6Hot硬度，Shore-D @ 175°C，90秒80工藝流程數據處理預熱溫度，°C 80至90模具溫度，℃170至190轉印壓力，Kgf / cm240至85轉印時間，秒5至10固化時間，3 mm部分：常規模具：@175oC，秒60至90Automold：@175oC，秒50至90固化@ 175°C，小時2至6GR869已被配制，以提供*佳可能的模塑性和寬的成型緯度雖然成型和固化條件會因情況而異，但推薦的起始范圍如上所示StorageStore產品在未開封的容器中，在干燥的位置。儲存信息可能在產 |
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