ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/ECCOBOND A164-1電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 20,000
Shelf Life:
@ 0 to 8oC, months 4
@ 18 to 25oC, months 3 Density, ASTM-D-792, g/cc 1.1
ECCOBOND A164-1 provides the following product characteristics:
Technology Epoxy
Appearance Tan
Cure Heat cure
Product Benefits • Non-conductive
• Good adhesion
• Good peel strength
• Excellent thermal shock resistance
• One component
Application Automotive Electronics Substrates Metals, Glass and Plastics
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）20,000
保質(zhì)期：
@ 0至8oC，月4
@ 18至25oC，月3密度，ASTM-D-792，g / cc 1.1
ECCOBOND A164-1提供以下產(chǎn)品特性：
技術(shù)環(huán)氧樹脂
外觀譚
治療熱固化
產(chǎn)品優(yōu)點(diǎn)•不導(dǎo)電
•附著力好
•良好的剝離強(qiáng)度
•優(yōu)異的耐熱沖擊性
•一個組件
應(yīng)用汽車電子基材金屬，玻璃和塑料以上治療方案是指導(dǎo)性建議。固化條件（時間和溫度）可能會根據(jù)客戶 |
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