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ECCOCOAT PC355-1 is a flexible varnish protects andinsulates printed wiring boards both on the component sideand on the soldered side. ECCOCOAT PC355-1 can besoldered through, which simplifies repair and the change ofcomponents on the wiring boards.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP) 250 to 450
Specific Gravity 0.87 to 0.92
Shelf Life @ 18 to 25°C, year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
Dust Dry:
30 minutes @ 18 to 25°C or
10 minutes @ 80°C
Completely Dry:
60 minutes @ 80°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 18 to 25 °C
ECCOCOAT PC355-1是一種柔性清漆保護和在組件側絕緣印刷電路板并在焊接的一邊。 ECCOCOAT PC355-1可以焊接通過,這簡化了維修和更換組件在接線板上。
固化材料的典型特性
粘度,Brookfield,25℃,mPa•s(cP)250〜450℃
比重0.87〜0.92
保質期為18至25°C,第1年
閃點 - 參見MSDS
典型的固化性能
治愈時間表
防塵:
18分鐘至25°C 30分鐘
在80℃下10分鐘
完全干燥
80分鐘60分鐘
以上治療方案是指導性建議。治愈條件(時間和溫度)可能會有所不同客戶的經驗和應用要求以及客戶固化設備,烤箱 |