HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/HYSOL QMI536HT電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 ABLESTIK QMI536HT die attach paste was designed to
attach integrated circuits and components to advanced substrates.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
Speed 5 rpm 13,000
Thixotropic Index (0.5/5 rpm) 5.5
Specific Gravity @ 25oC 1.25
Pot life @ 25 °C, hours 24
Shelf Life @ -40°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Conventional Oven
15 minutes @ 150°C at bondline
Snap Cure Schedule
≥10 seconds @ 150°C at bondline
Tunnel Oven configured with hot gas or IR
≥10 seconds @ 150°C at bondline
SkipCure Process
≥8 seconds @ 150°C at bondline
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage : -40 °C 樂泰 ABLESTIK QMI536HT貼片膏被設計成
將集成電路和組件連接到高級基板。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
速度5 rpm 13,000
觸變指數（0.5 / 5 rpm）5.5
比重@25oC1.25
適用于25°C，24小時
保質期@ -40°C，365天
閃點 - 見SDS
典型的固化性能
常規烤箱
15分鐘@ 150°C
治療時間表
在粘合線上150℃下≥10秒
隧道爐配置熱氣或紅外線
在粘合線上150℃下≥10秒
SkipCure過程
在粘合線上150℃下≥8秒
以上治療方案是準則建議。 |
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。