ABLEBOND 84-1LMISR4電子組裝/工業膠水/電子組裝膠水/工業用膠
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樂泰 ABLESTIK 84-1LMISR4 electrically conductive die attachadhesive has been formulated for use in high throughput, automateddie attach equipment.
The rheology of 樂泰 ABLESTIK84-1LMISR4 adhesive allows minimum adhesive dispense and die put
down dwell times, without tailing or stringing problems.
The unique combination of adhesive properties makes this materialone of the most widely used die attach materials in the semiconductorindustry.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 5.6
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 8,000
Work Life @ 25 °C, Physical worklife by % filler, hours 18
Shelf Life @ -40°C (from date of manufacture), days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
Alternate Cure Schedule
3 to 5 minute ramp to 175°C + 1 hour @ 175°C (1)
Weight Loss
10 x 10 mm Si die on glass slide, % 5.3
(1)The ramp was observed to yield reduced bondline voiding andincreased strength.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties.
樂泰 ABLESTIK 84-1LMISR4導電芯片貼片膠粘劑已被配制成用于高通量，自動化貼片設備。 樂泰 ABLESTIK的流變學84-1LMISR4膠粘劑允許*小的粘合劑分配和模具放置停留時間，沒有拖尾或拉繩問題。
粘合性能的獨特組合使得這種材料半導體中*廣泛使用的芯片附著材料之一行業。
固化材料的典型特性
觸變指數（0.5 / 5 rpm）5.6
粘度，Brookfield CP51,25℃，mPa•s（cP）：
速度5轉8,000
25°C的工作生活，填充物的體力活力，小時18
保質期@ -40°C（制造日期），第 |
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