樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/樂(lè)泰 5810F電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰®5810F™ is a single component, non-silicone,
oxime-free, polyacrylate based adhesive/sealant that cures
with moisture at room temperature. It is designed with a heavy
body viscosity for on line, low air pressure tests to be carried
out before product begins to cure. The non-silicone based resin
does not promote foaming in lubricants and exhibits excellent
resistance to powertrain fluids. 樂(lè)泰®
5810F™ is primarily
designed for flange sealing with excellent oil resistance.
Typical applications include cast metal, stamped steel, and
molded plastic covers for engines, transmissions and axles.
This product also works well for sealing plastic and metal
housings on electronic components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 20 °C 1.25 to 1.45
Flash Point - See MSDS
Extrusion Rate, g/min:
Pressure 0.6 MPa, temperature 25 °C:
Semco Cartridge 25 to 85
Blow Out Resistance, seconds:
6 mm Flange, 1.0 mm Gap @ 0.014 MPa 10
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties. 樂(lè)泰®
5810F™是單組分，非硅膠，
無(wú)肟，聚丙烯酸酯基粘合劑/密封劑固化
在室溫下保持水分。它設(shè)計(jì)有一個(gè)沉重的
體內(nèi)粘度在線，低氣壓試驗(yàn)要攜帶
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