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技術服務熱線：021-51693135 / 021-22818476
Product 3888 is designed for bonding of metals, ceramics,
rubbers and plastics as used in electronic parts, where good
adhesion combined with electrical and thermal conductivity is
required. Typical applications include solder replacement,
repair/rework of interconnections, and bonding of heat
sensitive components where solder temperatures are
impractical.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25°C 2.50
Hardness, Shore D 89
Mix Ratio, Resin: Hardener 100:6
Pot life, minutes 90
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to room
temperature heat for 24 - 48 hours. Rate of cure and final
strength will depend on the residence time at the cure
temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength
developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow
for heat up period.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
If supplied as separate containers of parts A and B, store
at room temperature for up to 6 months. If supplied
pre-mixed and frozen, store at -40°C for up to 1 year. Shelf
life will vary with speciality packages
產品3888專為金屬，陶瓷，
橡膠和塑料用于電子零件，哪里好粘合結合電導熱性
需要。典型應用包括焊料更換，互連的修復/返修以及熱的粘合焊料溫度敏感的組件不切實際的。
固化材料的典型特性
比重@ 25°C 2.50
硬度，Shore D 89
混合比，樹脂：固化劑100：6
可用壽命，90 |
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