樂泰 3563電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰®3563™ is a rapid curing, fast flowing, liquid epoxy
designed for use as a capillary flow underfill for packaged ICs,
such as CSPs and BGAs. Its rheology is designed to allow it to
penetrate gaps as small as 25 μm. When fully cured, it
minimizes induced stress at solder joint and thus improves
thermal cycling performance.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.52
Viscosity, Cone & Plate rheometer, 2 ° Cone, mPa•s (cP):
Temperature: 25 °C, Shear Rate: 5 s
-1 5,000 to 12,000LMS
Temperature: 25 °C, Shear Rate: 20 s
-1 5,000 to 12,000
Capillary Flow Rate, seconds:
Flow time, 100 °C, glass to glass, 25 μm:
6.35 mm flow ≤15
12.7 mm flow ≤45LMS
25.4 mm flow ≤150
VOC, ASTM D 3960, g/l <10
Moisture Content, ASTM D 4017, % 0.01
Total Volatile Content, ASTM D 2369, % <1
Filler Content, % 40
Particle Size, μm:
Average 1 to 2
Maximum <10
Pot life @ 22 °C, hours 8 to 12
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Product shall be ideally stored at ≤-40 °C.
樂泰®
3563™是快速固化，快速流動的液體環氧樹脂
設計用于封裝IC的毛細管流動底部填充，
如CSP和BGA。其流變學設計允許它
穿透小至25μm的間隙。當完全治愈，它
*大限度地減少焊點處的應力，從而提高焊接接頭的應力
熱循環性能。
固化材料的典型特性
比重@ 25°C 1.52
粘度，錐板流變儀，2°錐，mPa•s（cP）：
溫度：25°C，剪切速率：5 s
-1 5,000至12,000LMS
溫度：25°C，剪切速率：20 s
-1 5,000至12,000
毛細管流量，秒數：
流動時間，100°C，玻璃到玻璃，25μm：
6.35毫米流量≤15
12.7毫米流量≤45LMS
25.4毫米流量≤150
VOC，ASTM D 3960，g / l <10
水分含量，ASTM D 4017，％0.01
總揮發物含量，ASTM D 2369，％<1
填料含量％40
粒徑μm：
平均1到2
*大<10
適用于22°C，8至12小時
存儲
將產品存放在未開封的 |
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。