HYSOL GR750HT-25電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線：021-51693135 / 021-22818476
Hysol®GR750HT-25™ is an epoxy molding compounddesigned to improve thermal management in semiconductordevices.
GR750HT-25™ meets UL 94 V-0 Flammability at 3.175mmthickness.
TYPICAL PROPERTIES OF UNCURED MATERIALGel Time @ 175 °C, seconds 34Spiral Flow, @ 175°C, cm 55Shelf Life:@ 5oC, months 12Flash & bleed, mm:3.0 mil 1.52.0 mil 11.0 mil 10.5 mil 10.25 mil 0.5TYPICAL PROCESS DATAHandlingPreheat Temperature 85 to 95Molding Temperature, °C 165 to 190Molding Pressure, Kg/cm2 45 to 85Transfer Time, seconds 12 to 20Curing Time, 3 mm section:@ 170oC, seconds 90 to 120@ 190oC, seconds 75 to 105Post Cure @ 175°C, hours 4 to 6GR750HT-25™ has been formulated to provide the bestpossible moldability and as wide a molding latitude as possible.
Although molding and curing conditions will vary from situationto situation, recommended starting ranges are shown aboveStorage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Powder Storage - Powder or preforms should be stored at 5oCor below, in closed containers.
After removal from coldstorage, the material MUST be allowed to come to roomtemperature, in the sealed container, to avoid moisture contamination.
The suggested waiting time for a standard 15kg carton box is 24 hours.
Hysol®GR750HT-25™是一種環氧樹脂模塑料，用于改善半導體器件的熱管理.GR750HT-25™符合UL 94 V-0易燃性3.175mm厚度。
固化材料的特性時間175℃，秒34螺旋流，@ 175 °C，cm 55Shelf壽命：@5oC，月12沖洗和流出，mm：3.0密耳1.52.0密耳11.0密耳10.5密耳10.25密耳0.5特殊工藝數據處理預熱溫度85至95鑄型溫度，165至190壓鑄壓力，Kg / cm 2 45至85轉印時間，秒12至20固化時間，3 mm部分：@170oC，秒90至120 @190oC，秒75至105固化@ 175°C，小時4至6GR750HT-25™已配制成提供*佳可能的成型性和盡可能寬的成型緯度。
盡管成型和固化條件會因情況而異，但推薦的起始范圍如上所示
StorageStore產品在未開封的容器中，在干燥的位置。
存儲信息可能在產品容器標簽上指示。粉末儲存 - 粉末或預制 |
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