樂泰 3619電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
3619™ is designed for the bonding of surface mounted devices
to printed circuit boards prior to wave soldering. Particularly
suited where low curing temperatures are required with heat
sensitive components, and in applications where short curing
times are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.22
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
200 to 450LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
1 to 4
Particle Size, μm <100
Flash Point - See MSDS
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s
-1 which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties.
3619™是為表面貼裝設備而設計的
到波峰焊前的印刷電路板。尤其
適用于需要低固化溫度的熱量
敏感組件，以及短時間固化的應用
需要時間。
固化材料的典型特性
比重@ 25°C 1.22
屈服點，25°C，Pa
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
200到450LMS
卡松粘度@ 25°C，Pa∙s
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
1到4
粒徑μm<100
閃點 - 參見MSDS
粘度VS.溫度
下圖顯示了典型的溫度 - 粘度
使用Haake旋轉透視計PK100測量的曲線，
M10 / PK1 2°錐形系統，剪切速度為2 s
-1是
代表分配噴嘴中的剪切速率。
機艙或噴嘴溫度在30°C至35°C時提高
范圍可能有助于在更高的分配時分配性能
速度。
存儲
將產品存放在未開封的容器中 |
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