HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/HYSOL FP4470電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 ECCOBOND FP4470 features excellent flow propertiesallowing the material to penetrate fine pitch wires and deep cavitieswithout entrapping voids. This product can withstand solder reflow after
being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours)
preconditioning.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 6, speed 10 rpm 42,000
Specific Gravity @ 25 °C 1.8
Pot Life @ 25oC, days 3
Shelf Life @ -40°C, days 274
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Gel Time
12 minutes @ 121°C
Cure Schedule
30 minutes @ 125°C + 90 minutes @ 165°C
樂泰 ECCOBOND FP4470 should be dispensed onto a
substrate warmed to approximately 75°C.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures. STORAGE:
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: -40°C. Storage below -40°C or greater than -40
°C can adversely affect product properties. 樂泰 ECCOBOND FP4470具有出色的流動特性
允許材料穿透細間距線和深空腔
沒有截留空隙。本產品可以耐受回流焊
暴露于JEDEC 2A級（60°C / 60％RH，120小時）
預處理
固化材料的典型特性
粘度，Brookfield - RVF，25℃，mPa•s（cP）：
主軸6，轉速10 rpm 42,000
25°C時的比重1.8
25℃的天氣，第3天
保質期@ -40°C，天274
閃點 - 見SDS
典型的固化性能
凝膠時間
12分鐘 |
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