ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/ECCOBOND 285電子組裝/工業膠水/電子組裝膠水/工業用膠
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Product Description: ECCOBOND 285 is a very versatile, versatile curing agent that can be cured in a different way as shown below. All curing agents impart a degree of thixotropic material to the uncured agent even at elevated temperatures. This property is in fact protected from drooping or running on a vertical or top surface or run out when used to lose fit, such as pipe fittings
Application: ECCOBOND 285 produces rigid, highly resistant to most materials (including metal, glass, ceramic and most plastics.) As a 100% solid binder, it exhibits the same non-porous surface on porous or the like ECCOBOND 285 There are two outstanding applications that should be of particular interest in property applications. Thermal expansion coefficient ECCOBOND 285 is generally much lower than brass, copper, and aluminum commonly used in adhesives. The heat conductivity is high. This combination works well Overcoming the failure due to thermal cycling.
Instructions for use: curing agent selection: from the information provided, select the most suitable for your catalyst requirements: catalyst 9. Room temperature curing - for 45 minutes 0,5 kg mass - thixotropy and viscosity highest - paste consistency - can be applied to the vertical or top surface in the thick part without flow or sagging - continuous use up to 120 ° C for a short time exposed to 150 ° C Catalyst 11.
產品說明：ECCOBOND 285是一種非常通用，通用的固化劑，可以通過以下不同的方式固化。所有固化劑即使在升高的溫度下也向未固化劑賦予一定程度的觸變材料。實際上，該屬性在垂直或頂部表面上不會下垂或運行，或者當用于失去配合時會流出，例如管件
應用：ECCOBOND 285對大多數材料（包括金屬，玻璃，陶瓷和大多數塑料）產生剛性，高度 |
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