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樂泰 ABLESTIK 84-1A adhesive is designed for highvolume semiconductor packaging applications. This adhesiveis ideal for application by printing, dispensing or stamping.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 18,000
Work Life @ 25°C, weeks 2
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
10 minutes @ 180°C
Alternative Cure Schedule
6 minutes @ 200°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties. 樂泰 ABLESTIK 84-1A膠粘劑專為高體積半導(dǎo)體封裝應(yīng)用。這種粘合劑是通過印刷，分配或沖壓應(yīng)用的理想選擇。
固化材料的典型特性
粘度，Brookfield CP51,25℃，mPa•s（cP）：
速度5 rpm 18,000
工作生活@ 25°C，第2周
保質(zhì)期@ -40°C（制造日期），第365天
典型的固化性能
治愈時(shí)間表
180°C 10分鐘
替代治療計(jì)劃
在200°C下6分鐘
以上治療方案是指導(dǎo)性建議。 |
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