樂泰 3874電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 3874 is a thermally conductive adhesive. When usedwith Activator 7387™, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer.
Typicalapplications include bonding heat sinks to heat dissipatingcomponents such as BGAs in electronics applications. Thethixotropic nature of 樂泰 3874 reduces the migration ofliquid product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.08Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):Spindle TB, speed 0.5 rpm, Helipath 800,000 to 1,800,000LMSSpindle TB, speed 5 rpm, Helipath 200,000 to 450,000LMS Cure Speed vs. SubstrateThe rate of cure will depend on the substrate used. The graphbelow shows the shear strength developed with time on gritblasted steel lap shears and tested according to ISO 4587.(Activator 7387™ applied to one surface).
StorageStore product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than8 °C can adversely affect product properties.
樂泰 3874是導熱粘合劑。
當與Activator 7387™一起使用時，它可快速固化，形成高溫強度，高模量，熱固性丙烯酸聚合物。
典型應用包括將散熱片連接到散熱部件，如電子應用中的BGA。
樂泰 3874的觸變性降低了應用于基材后液體產品的遷移。
固化材料的特性比重@ 25°C 2.08閃點 - 參見SDSViscosity，Brookfield - HBT，25°C，mPa•s（cP）：主軸TB，轉速0.5 rpm，Helipath 800,000至1,800,000LMS主軸TB，轉速5 rpm，Helipath 20萬至45萬LMS固化速度與底物固化速率取決于所用的底物。
曲線圖顯示了經過噴砂鋼絞線剪切力隨時間推移的剪切強度，并根據ISO 4587測試（活化劑7387™應用于一個表面）。
StorageStore產品在未開封的容器中干燥處。
存儲信息可能在產品容器標簽上顯示。
*佳儲存：2°C至8°C。低于2°C或高于8°C的儲存可能會對產品性能產生不利影響 |
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