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技術服務熱線：021-51693135 / 021-22818476
樂泰®3880™ is designed for bonding of metals, ceramics,
rubbers and plastics as used in electronic parts, where good
adhesion combined with electrical and thermal conductivity is
required. Typical applications include bonding surface mount
devices to flexible or rigid substrates, bonding of
semiconductor elements, joining EMI parts, bonding
electrodes, lead wires or other connectors that require
conductivity.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.4
Viscosity, Brookfield - RVT, 25 °C, mPa•s (cP):
Spindle 14, speed 5 rpm
, with small sample adaptor
50,000 to 150,000LMS
VOC, ASTM D 3960, g/l 74
Moisture Content, ASTM D 4017, % <0.01
Total Volatile Content, ASTM D 2369, % 3.0
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
10 minutes @ 125 °C
6 minutes @ 150 °C
3 minutes @ 175 °C
Note: Sufficient time must be added to allow the bond location
to reach the desired cure temperature. Alternate cure profiles
may be evaluated.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 0 °C to -10 °C. Storage below minus
(-)10 °C or greater than 0 °C can adversely affect product
Properties
樂泰®
3880™是為金屬，陶瓷，
橡膠和塑料用 |
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