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技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ABLEBOND®958-11 adhesive is designed to absorb stressesproduced when bonding large ICs.
MIL-STD-883
ABLEBOND®
958-11 meets the requirements of MIL-STD-
883, Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 40,000 to 50,000
Work Life @ 25°C, weeks 2
Shelf Life @ -40°C (from date of manufacture), year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
2 hours @ 130°C
Alternative Cure Schedule 1
1 hour @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C orgreater than minus (-)40 °C can adversely affect product
properties.
ABLEBOND®958-11粘合劑設(shè)計用于吸收應(yīng)力當(dāng)大IC集成時產(chǎn)生。
MIL-STD-883
ABLEBOND®
958-11符合MIL-STD-
883，方法5011。
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）40,000〜50,000
工作生活@ 25°C，第2周
保質(zhì)期@ -40°C（從制造日期），第1年
閃點(diǎn) - 參見MSDS
典型的固化性能
治愈時間表
2小時@ 130°C
替代治療附表1
150℃下1小時
以上治療方案是指導(dǎo)性建議。治愈條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗(yàn)及其應(yīng)用要求，以及客戶
固化設(shè)備，烤箱加載和實(shí)際烤箱溫度
存儲將產(chǎn)品存放在未開封的容器中，干燥處。存儲信 |
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