HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/HYSOL ES2207電子組裝/工業膠水/電子組裝膠水/工業用膠
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HYSOL®ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound.
This material has excellent adhesion to many substrates, and has good surface appearance. It will meet UL 94 V-0 requirements in 1/8 inchthickness.
TYPICAL PROPERTIES OF UNCURED MATERIAL Part A Properties Density, @ 25 °C, g/cm3 1.68Solids Content, % 100Filler Content, % 47Viscosity, Brookfield - RVF, 25 °C, cP:Spindle , speed r/min 14,000Part B Properties Density, @ 25 °C, g/cm3 1.0Solids Content, % 100Filler Content, % 0Viscosity, Brookfield - RVF, 25 °C, cP:Spindle , speed r/min 180Mixed Properties Pot Life, 200 gm mass, @ 25 °C, minutes 90Viscosity, Brookfield - RVF, 25 °C, cP:Spindle , speed r/min 8,800TYPICAL CURING PERFORMANCE Recommended Curing Conditions24 hours @ 25 °C (Recommended cure)2 hours @ 60 °C (Alternate cure)TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties:Coefficient of Linear Thermal Expansion, ppm/oC:Alpha 1, Below Tag @ -20 to 30 °C 66.3Alpha 2, Above Tag @ 60 to 100 °C 159.1Flammability, 3mm, 94V-0 Passes Tensile Strength, psi 1,400Elongation ,% 20StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Liquid Storage - Liquids should be stored at 23°C or below, in closed containers.
If stored below 23°C, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination.
HYSOL®ES2207™是一種填充，彈性，低粘度，室溫固化環氧樹脂灌封料。
該材料對許多基材具有良好的附著力，并具有良好的表面外觀。它將滿足1/8英寸厚度的UL 94 V-0要求。
固化材料的特性A部分特性密度，@ 25°C，g /cm31.68固體含量，％100填料含量，％47粘度，B |
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