HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/HYSOL EO1088電子組裝/工業膠水/電子組裝膠水/工業用膠
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EO1088 epoxy encapsulate particularly suited for use on transistors and similar semiconductors, and can be used for encapsulation of watch ICs.
The cured material survives severe thermal shock and offers continuous service to 177 °C.TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield - RVF, 25 °C, mPa•s (cap):Spindle 7, speed 4 rpm 6,200Specific Gravity 1.56Shelf Life @ 4°C, months 12Gel Time @ 121oC, minutes 3.5Flash Point - See MSDSTYPICAL CURING PERFORMANCE Recommended Cure Schedule30 minutes @ 150°CAlternative Cure Schedule90 minutes @ 140°C or2 hours @ 120°CThe above cure profile is a guideline recommendation.
Cure conditions(time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion ppm/°C:Below Tag 35Above Tag 125Glass Transition Temperature (Tag), °C 125Shore Hardness, ISO 868Shore D ≥88Water Absorption, ISO 62, %:24 hours immersion @ 24°C 0.0524 hours immersion @ 50°C 0.
16StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 4 °C.
EO1088環氧密封劑特別適用于晶體管和類似半導體，并可用于手表IC的前期封裝。
固化材料存在嚴重的熱沖擊，并提供連續使用至177°C。固化材料的性能特性粘度，Brookfield-RVF，25°C，map’s（cap）： |
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