HYSOL KL-6300S電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術服務熱線:021-51693135 / 021-22818476
Product HYSOL KL-6300S describes epoxy molding compounds with excellent product performance and ease of use.
This material meets the requirements of JEDEC Level 1 at 260 ° C reflow temperature.
Thermal conductivity 0.8 W / mK MSL L1 / 260 ° C Linear flow, cm 58 Hot plate gel time, seconds 23 Filling content% 75 CTEa1, ppM / ° C 15 Tg, ° C 158, main features
Low stress; excellent formability; high reliability; low cost of ownership.
產品HYSOL KL-6300S 描述 環氧塑封料,具有出色產品性能并且易于使 用。
這一材料滿足 260℃回流溫度下 JEDEC 1 級要求。
導熱率 0.8 W/mK MSL L1/260℃ 線性流 動,厘米 58 熱板凝膠 時間,秒 23填充含 量 % 75 CTEa1, ppM/℃ 15 Tg, ℃ 158,主要特點
低應力;優良的成形性;高可靠性;低擁有成本。 |