漢高漢高樂泰樂泰 ES 4512
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ES4512HF epoxy system is designed for potting electronic devices.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties :
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 7, speed 2 rpm 184,000
Spindle 7, speed 20 rpm 80,000
Filler Content, % 50
Solids Content, % 100
Density @ 25oC, g/cm3 1.57
Flash Point - See MSDS
Part B Properties:
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 5, speed 10 rpm 11,000
Filler Content, % 60
Solids Content, % 100
Density @ 25oC, g/cm3 1.48
Flash Point - See MSDS
Mixed Properties:
Density @ 25oC, g/cm3 1.55
Miscellaneous - Hysol®
:
Pot Life, 300 gm mass, @ 25 °C, minutes 80
Gel Time @ 25 °C, hours 5
TYPICAL CURING PERFORMANCE
Recommended Cure
36 to 48 hours @ 25°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , ASTM D3418:
Below Tg, ppm/°C 39.7
Above Tg, ppm/°C 177
Glass Transition Temperature, ASTM D3418, °C 40
Linear Shrinkage, % 1
Hardness, Shore D 88
Water Absorption, %:
24 hours @ 25°C in water 0.13
Peak Exotherm Temp, oC 30
Electrical Properties:
Volume Resistivity, Ω•cm 3.82×1018
Surface Resistivity, Ω 8.12×1017
Dielectric Constant :
100-Hz 4.029
1-KHz 3.913
1-MHz 3.666
TYPICAL PERFORMANCE OF CURED MATERIAL
Miscellaneous:
Tensile Strength N/mm2 30
(psi) (4,470)
Flexural Strength N/mm2 55
(psi) (7,820)
es4512hf環氧系統是專為電子器件的灌封。
固化材料的典型性能
零件屬性：
粘度，Brookfield -裂谷熱，25°C，MPA•S（CP）：
主軸7，轉速2轉184000
主軸7，轉速20轉80000
填料含量，% 50
固 |
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