規格：
高純銀：99.999% Ag-5N-F-29
檢測雜質：Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn
雜質總含量：≤10ppm
高純銀：99.9999% Ag-6N-F-30
檢測雜質：Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn
雜質總含量：≤1ppm
用途：主要用于制備高純半導體合金、電子管、晶體管焊接材料、精密儀表接點材料及原子反應堆控制棒等。
包裝：聚乙烯塑料瓶包裝外套雙層復合膜真空封裝或玻璃管真空封裝。
Specification:
High purity Ag: 99.999% Ag-5N-F-29
Testing impurity: Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn
Total impurity content: ≤10ppm
High purity Ag: 99.9999% Ag-6N-F-30
Testing impurity: Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn
Total impurity content: ≤1ppm
Application: Used for the preparation of high purity semiconductor alloy, electron tubes, transistor welding material, precision meter contact material, and control rod of atomic reactor etc.
Package: Packed with polythene plastic bottle, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.
注：產品實際價格以詢價為準！ |
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