規(guī)格：
高純錫：99.999% Sn-5N-I-15
檢測雜質(zhì)：Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn
雜質(zhì)總含量：≤10ppm
高純錫：99.9999% Sn-6N-I-16
檢測雜質(zhì)：Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn
雜質(zhì)總含量：≤1ppm
高純錫：99.99999% Sn-7N-I-17
檢測雜質(zhì)：Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn
雜質(zhì)總含量：≤0.1ppm
用途：主要用于制備化合物半導(dǎo)體、高純合金、超導(dǎo)材料、焊料以及化合物半導(dǎo)體的摻雜劑。
包裝：滌綸薄膜包裝后雙層復(fù)合膜真空封裝或直接玻璃管真空封裝。
Specification:
High purity Sn: 99.999% Sn-5N-I-15
Testing impurity: Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn
Total impurity content: ≤10ppm
High purity Sn: 99.9999% Sn-6N-I-16
Testing impurity: Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤1ppm
High purity Sn: 99.99999% Sn-7N-I-17
Testing impurity: Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤0.1ppm
Application: Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.
Package: Packed with terylene film, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.
注：產(chǎn)品實(shí)際價(jià)格以詢價(jià)為準(zhǔn)！ |
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