配置參數/Machine specification
● Table top machine, designed for low production through hole soldering or repairing. 桌上形機器，適合進行小批量通孔焊接或返修。
●Portable hand-hold programmer with drivers form a stable and efficient system；
手持編程器與驅動器構成一個穩定、安全且高效的操控系統；
● Solder pot and spray is fixed, PCB is moving with X/Y/Z direction. Table moving path and moving speed can be set in programmer. 錫爐與噴霧頭固定，PCB進行X/Y/Z方向的運動，手持編程器中進行運行路徑，運行速度的設定。驅動器控制X及Y方向步進電機運動， Z方向由氣缸控制。。
● IR light point to top of PCB, it align the same position with wave nozzle’s position, easy to figure out the area need to soldering and spraying. 紅外線點配合編程器進行教學式編程，操作簡單易學。
● N2 heating system can heat N2 from 25--350c degree, reduce the solder dross generating meanwhile preheat the soldering pad. 氮氣加熱系統可加熱氮氣溫度25--350度，減少氧化，提高焊錫流動性。
● Optional with mini spray flux nozzle, precious with good atomization effect. Flux stocked in pressure tank, make sure the flux is already under the same working pressure, so the flux flow will not be influenced by quantity of flux. 可選配上噴霧噴嘴,實現助焊劑的點噴，單點可達直徑5MM。助焊劑放置在壓力容器內，保證助焊劑所受的壓力穩定，不受助焊劑的多少影響。
● Optional to equip with in-time camera&monitor system to show whole soldering process, without open machine’s hood customer can see the soldering and it’s result. 可選配焊接實時顯示相機與顯示器，可實時的監測焊接情況。
Item 機型 ECOSEL-300
General 整體
Operating power/Max power 運行功率/總功率 1.5KW/4KW
PCB dimension PCB尺寸范圍 50x50---300x300mm
Machine dimension 機器尺寸 680(W)*900(D)*700(H)
Net weight 機器凈重 80KG
Power supply 電源 1PH 220V 50HZ
Air supply 氣源 3-5 bars
Exhausting required 抽風 100M3/h
PCB Robotic Platform 機器人平臺
Axes of Motion 運動軸 X, Y, Z
Motion Control 運動控制 X,Y 步進控制，Z軸氣動控制
Position Accuracy 定位精度 + / - 0.1mm
Solder Management 焊錫管理
Standard Solder Stations 標準錫爐 1
Solder Pot Capacity 錫爐容量 15 kgs
Solder Temperature Control 錫溫控制 PID
Heat-Up Time 熔錫時間 45 Minutes
Max Temperature *高錫溫 380 C
Solder Pot heater 錫爐功率 3kw
Solder Nozzles 焊錫噴嘴
MiniWave Nozzles 噴嘴尺寸 Dia 2 to 8mm
Customized nozzle 定制噴嘴 可提供
Nitrogen (N2) Inertion Management 氮氣管理
N2 Heater 氮氣加熱器 standard equipped 標配
N2 Temp PID Control Range 氮氣溫度范圍 0 - 350 C
N2 Consumption per Nozzle 氮氣消耗量 1.5m3/H/NOZZLE
Required N2 Purity | Oxygen 要求氮氣純度 O2 < 20 PPM
Optional Flux Management 可選助焊劑涂覆
Spray Flux Nozzle 助焊劑噴嘴 Mini spray fluxer, atomization type 霧化細口噴閥
Flux Capacity助焊劑容量 1.2L
Flux Tank 助焊劑罐 Pressure tank 恒壓罐
Controlling System 控制系統
Program method 路徑編程 Portable programmer 示教器
Controlling system 控制部份 Touchscreen 觸摸屏
Typical Program Time 通常編程時間 10 Minutes |
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