1.Interflux IF8300
InterfluxIF 8300 is a noclean, halide free and colophony free tacky gel flux with minimal residues after soldering. The flux provides resin-like rheological properties. It is available in different viscosities for different applications. The IF 8300 series can be applied by printing, dispensing or by brush. The IF 8300 gel flux series is compatible with both lead-free and lead containing alloys. The flux exhibits good wetting on virtually all surface finishes including OSP, NiAu, I-Sn...etc. The residues are minimal and transparent and do not require any cleaning.
2.Interflux IF 7500HAB
Interflux IF 7500HAB is a noclean, halide free tacky gel flux with increased activity. The flux provides resin-like rheological properties. The IF 7500HAB can be applied by printing, dispensing, dipping or by brush. The IF 7500HAB gel flux is compatible with both lead-free and lead containing alloys. The flux exhibits excellent wetting on virtually all surface finishes including OSP, NiAu, ISn...etc. The residues are minimal and transparent and do not require any cleaning.
3.Interflux IF6000
IF 6000 is a no-clean soldering flux developed for selective fluxing applications. IF 6000 is suitable for SnPb and lead-free alloys. Typical processes where IF 6000 can be used are hand soldering, touch up, automated soldering, BGA Rework, stamp soldering, “wafer bumping”,... The flux has not been developed for selective wave applications. IF 6000 is absolutely halogen free. Residues are very safe, also in an unconsumed state. The flux contains natural rosin, providing a wide working window. Depending on the amount of flux and the temperature profile, the flux may leave a slight residue after soldering |
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