用途
主要供給高階IC使用如在ASIC等高功能芯片,主要使用于計算機的MPU或通信設備等里面。
材料
主體是多層共燒氧化鋁陶瓷、以銅/銀焊接(Brazing)的方式安裝上鐵•鎳•鈷合金等的Pin端子
特征
通過陶瓷多層配線的結構形成細微的配線電路，可對應電氣特性的多功能化，并能形成一集成的內置電容；外部端子除了可對應插座貼裝用以外也可支持小節距的表面貼裝，可支持400 pin以上或更多的外部端子的要求。
Pin grid array (PGA)
Application
This package is equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a computer and communications equipment.
Material
The main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of iron, nickel, and cobalt are attached with silver-brazing to the main body.
Features
This package, in which there are ultra-fine wiring circuits created based on a ceramic multilayer wiring structure, supports multifunctional electric properties and can create an integrated built-in capacitor. The external terminal is used not only for socket installation but also supports a fine pitch for surface installation. In addition, it can support cases where external terminals with 400 pins or more is needed. |
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