樂泰 3523電子組裝/工樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/樂泰 3523電子組裝/業膠水/電子組裝膠水/工業用膠
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樂泰 3523 is used to bond, seal or coat metal sandglass components in industrial applications.
This product is suitable for reinforcement of flexible PCB and for bonding aide range of materials.
When cured, it offers excellent flexibility and toughness, making it highly resistant to vibration and impact forces. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.06Refractive Index, ASTM D 1218 1.48Flash Point - See MSDSViscosity, Brookfield - RVF, 25 °C, mPa•s (cP):Spindle 6, speed 20 rpm 16,000 to 24,000LMSTYPICAL CURING PERFORMANCE樂泰 3523 cures when exposed to UV radiation of 365nm. To obtain full cure on surfaces exposed to air, radiation @220 to 260 nm is also required.
The speed of cure and depth of cure will depend upon the UV intensity and spectral distribution of the light source, the exposure time and the light transmittance of the substrates.
StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties.
樂泰 3523用于在工業應用中粘合，密封或涂覆金屬和玻璃部件。
該產品適用于加強柔性PCB和粘合各種材料。
固化時，具有優異的彈性和韌性，使其具有高抗振動和沖擊力。
固化材料的典型特性25°C 1.06
折射率ASTM D 1218 1.48閃點 - 見MSDSViscosity，Brookfield - RVF，25°C，mPa•s（cP）：主軸6，速度20 rpm 16,000至24,000當暴露于365nm的紫外線輻射時，固化性能實驗室3523固化。
為了在暴露于空氣的表面上獲得完全固 |
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