InTech-2000
High Speed, Reel to Reel, Pure Indium
The InTech -2000 is a high-speed, high efficiency, stable electroplating system designed for the rapid deposition of pure indium at a wide range of current densities.
M-Contact InTech-2000 offers the advantage of being a pure indium, lead-free, plating process
providing an ultra-soft deposit that yields a uniform grain size, which is an excellent alternative to reduce the tendency for whisker growth. The process results in uniform, matte white deposits over a very wide cathode current density range. The resulting deposits have excellent reflow properties and are great for press fit applications.
InTech -2000是一種高速、高效、穩(wěn)定的電鍍系統(tǒng)，專為在廣泛的電流密度下快速沉積純銦而設計。 InTech -2000具有純銦無鉛電鍍工藝的優(yōu)勢，提供超軟鍍層，產(chǎn)生均勻的晶粒尺寸，這是減少晶須生長趨勢的絕佳選擇。該工藝在極寬的陰極電流密度范圍內(nèi)產(chǎn)生均勻的啞光白色沉積 物。所得到的沉積物具有優(yōu)異的回流性能，對壓濾效果很好。
READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT
在使用本產(chǎn)品之前，請閱讀完整的技術說明書
Features 特性 Benefits 優(yōu)點
Operates over a wide current density range
在寬電流密度范圍內(nèi)工作 Uniform plating thickness regardless of part geometry
鍍層厚度均勻，不考慮零件幾何形狀
Analyzable additives
可分析的添加劑 Easy to maintain and control
易于維護和控制
Simplified effluent treatment
簡化污水處理
Environmentally friendly process
環(huán)保工藝
High efficiency
效率高 Consistent plating rate throughout the life of the bath
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