led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠
led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠
led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠 led 灌封膠
液態封裝樹酯具有可靠性佳、內應力極低、顆粒極細小等特性,用于涂布于芯片四周以保護組件。常用于BGA、CSP、覆晶等封裝應用