ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55 ECCOBOND 55
ECCOBOND 55 is an unfilled, low viscosity, general purpose epoxy adhesive resin that can be cured with a variety of catalysts. It features good wetting of most substrates and offers good chemical, solvent and water resistance. ECCOBOND 55 bonds well to glass, ceramics, metals and plastics.
本公司專業提供電子膠黏劑、樂泰 樂泰膠等產品服務和相關技術咨詢，歡迎廣大新老朋友就電子膠黏劑、樂泰 樂泰膠等方面的問題與我們溝通交流。
技術服務熱線：021-51693135 |
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