樂泰 ABLESTIK 8175Q樂泰膠水,電子膠水
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樂泰 ABLESTIK 8387B是一種非導電貼片粘合劑,已經(jīng)配制成用于高通量芯片附著應用。該粘合劑可以使用定向熱能或熱板固化技術快速固化。在傳統(tǒng)的箱子或對流式輸送機烘箱固化中,它可以在低至100oC的溫度下固化.BIB 8175Q設計用于更換焊料
微電子互連應用。
典型的固化性能
治愈減肥
治愈時減重%2.9
治愈時間表
150℃下1小時
替代治療計劃
在130°C下4小時
以上治療方案是指導性建議。固化條件(時間和溫度)可能會根據(jù)客戶的經(jīng)驗和應用要求以及客戶固化設備,烤箱裝載量和實際烤箱溫度而有所不同。
存儲
將產(chǎn)品存放在未開封的容器中,干燥處。存儲信息可能在產(chǎn)品容器標簽上顯示。*佳存儲:-40°C使用中從容器中取出的物質(zhì)可能會被污染。不要將產(chǎn)品返回原來的容器
樂泰 ABLESTIK 8387B is a non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100oC.ABLEBOND 8175Q is designed for solder replacement in
microelectronic interconnect applications.
TYPICAL CURING PERFORMANCE
Weight Loss on Cure
Weight Loss on Cure, % 2.9
Cure Schedule
1 hour @ 150°C
Alternative Cure Schedule
4 hours @ 130°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Storage
Store product in the unopen |
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