TRA-BOND 2129樂泰膠水,電子膠水
TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水TRA-BOND 2129樂泰膠水,電子膠水
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是一種低粘度環(huán)氧粘合劑,推薦用于工業(yè)和電子生產(chǎn),修理,小型鑄造,涂層,模具和剛性層壓應(yīng)用,需要具有良好機(jī)械和電氣特性的透明系統(tǒng)。 這種易于使用的環(huán)氧樹脂粘合劑在室溫下固化,并且對大多數(shù)材料(金屬,陶瓷和陶瓷插入物,玻璃和玻璃織物,木材和許多剛性塑料)產(chǎn)生強(qiáng)烈的低收縮粘結(jié)。 完全固化的TRA-BOND 2129是一種有效的電絕緣子,具有良好的低溫機(jī)械和抗沖擊性能,以及出色的耐水性,大多數(shù)石油產(chǎn)品,鹽溶液,弱酸和堿和許多其他有機(jī)和無機(jī)化合物。
固化時間240分鐘@溫度65.0°C
4.00小時@溫度149°F
1440分鐘@溫度25.0℃
24.0小時@溫度77.0°F
Material Notes:TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production,repair, small casting, coating,tooling, and rigid laminating applications where a clear system with good mechanical and electrical properties is required. This easy-to-use epoxy adhesive cures at room temperature and develops strong, low shrinkage bonds to most materials - metals, ceramics and ceramic inserts, glass and glass fabrics,wood and many rigid plastics. Fully cured TRA-BOND 2129 is an effective electrical insulator with good low temperature mechanical and impact resistance properties, and outstanding resistance to water,most petroleum products, salt solutions,mild acids and alkalis and many other organic and inorganic compounds.
Cure Time 240 min@Temperature 65.0 °C
4.00 hour@Temperature 149 °F
1440 min@Temperature 25.0 °C
24.0 hour@Temperature 77.0 ° |
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