TRA-BOND 2248樂泰膠水，電子膠水
TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水TRA-BOND 2248樂泰膠水，電子膠水
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是一種觸變性，高溫固化，100％固體的環氧樹脂體系，可在各種材料（包括金屬，玻璃，陶瓷和許多塑料）之間提供牢固的堅韌結合。該粘合劑被推薦用于高達190°C的粘合應用，需要良好的高低溫機械和電氣性能。它是一種全液體系統，在室溫下易于混合和處理和應用，盡管需要最終的高溫固化以獲得滿意的粘合。完全固化的TRA- BOND 2248具有優異的抗沖擊和耐熱沖擊性，對氣體和蒸氣的低滲透性，以及出色的耐水，耐候，氧氣和臭氧，大多數石油溶劑和燃料，弱酸和堿，以及許多其他有機和無機化合物。該系統符合美國航空航天局除氣可接受性的ASTM E-595-90規范。當預期應用溫度高于125°C時，建議在125°C下進行額外的后固化2小時。
固化時間60.0 min @溫度100°C
1.00小時@溫度212°F
Material Notes:TRA-BOND 2248 is a thixotropic, high temperature cure, 100% solids epoxy resin system that provides strong, tough bonds between a wide range of materials (includes metals, glass, ceramics, and many plastics). This adhesive is recommended for bonding applications up to 190°C where good high and low temperature mechanical and electrical properties are required. It is an all liquid system that is easily mixed and handled and applied at room temperature although a final high-temperature cure is REQUIRED for satisfactory bonds. Fully cured TRA- BOND 2248 has excellent impact and thermal shock resistance, low permeability to gases and vapors, and outstanding resistance to water, weather, oxygen and ozone, most petroleum solvents and fuels, mild acids and alkalis, and many other organic and inorganic compounds. This system complies with specification ASTM E-595-90 for NASA outgassing acceptability. An additional post-cure of 2 hours at 125°C is recommended when application temperatures higher than 125°C are anticipated.
Cure Time 60.0 min@Temperature 100 °C
1.0 hour@Temperature 212 ° |
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