TRA-BOND 223F01樂(lè)泰膠水，電子膠水
TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水TRA-BOND 223F01樂(lè)泰膠水，電子膠水
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
推薦用于要求高導(dǎo)熱性，長(zhǎng)使用壽命，低收縮率，優(yōu)異的耐化學(xué)性和低放熱性能的高溫接合應(yīng)用。 該材料容易在室溫下混合和處理，然而需要提高固化時(shí)間表以開(kāi)發(fā)材料的全部特性。 TRA-BOND 223F01為大多數(shù)金屬，玻璃和塑料基材提供了低的熱膨脹系數(shù)和優(yōu)異的附著力。 完全固化的TRA-BOND 223F01是一種機(jī)械堅(jiān)固耐用的電絕緣體，具有出色的抗水性，耐候性，鹽，弱酸和許多其他有機(jī)和無(wú)機(jī)材料。 根據(jù)ASTM E-595-90測(cè)試，該材料符合NASA的除氣規(guī)范要求。
固化時(shí)間360℃6.00小時(shí)3小時(shí)@ 125℃+ 175℃時(shí)3小時(shí)
Material Notes:TRA-BOND 223F01 is recommended for high temperature bonding applications where high thermal conductivity, long working life, low shrinkage, excellent chemical resistance and low exotherm properties are required. This material is easily mixed and handled at room temperature, however an elevated cure schedule is REQUIRED to develop the full properties of the material. TRA-BOND 223F01 provides a low coefficient of thermal expansion and excellent adhesion to most metals, glass and plastic substrates. Fully cured TRA-BOND 223F01 is a mechanically strong and durable electrical insulator, it provides outstanding resistance to water, weathering, salts, mild acids and many other organic and inorganic materials. This material complies with the requirements of NASA`s Outgassing Specification when tested according to ASTM E-595-90.
Cure Time 360 min 6.00 hour 3 hrs @ 125°C + 3 hrs @ 175° |
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