STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠
STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠STYCAST 50300HT樂泰膠水,環(huán)氧樹脂膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
Eccobond 50300HT球頂設(shè)計(jì)用于將環(huán)氧樹脂層壓板和類似基底上的引線接合裸芯片封裝在一起。該單組分材料的配方可確保使用壽命長(zhǎng)，使用時(shí)粘度非常穩(wěn)定。 建議用于具有高線材外形的IC和必須控制固化期間球頂部擴(kuò)散的應(yīng)用。
典型的固化性能
推薦治療時(shí)間2小時(shí)@ 150°C
低應(yīng)力固化時(shí)間表在120°C + 1小時(shí)@ 150°C時(shí)
存儲(chǔ)
將產(chǎn)品存放在未開封的容器中，干燥處。存儲(chǔ)信息可能在產(chǎn)品容器標(biāo)簽上顯示。*佳存儲(chǔ)：-40至0°C從容器中取出的物質(zhì)在使用過程中可能會(huì)受到污染。 不要將產(chǎn)品返回原來的容器。
Eccobond 50300HT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates.The formulation of this single component material ensures a long pot and a very stable viscosity during use. It is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule2 hours @ 150°C
Low Stress Cure Schedule1 hour @ 120°C + 1 hour @ 150°C
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage : -40 to 0 °C Material removed from containers may be contaminated during use. Do not return product to the original container |
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