ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水
ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水ABLEBOND®826-2樂(lè)泰膠水,固化性能膠水
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
ABLEBOND®826-2®粘合劑專為發(fā)光二極管(LED)連接而設(shè)計(jì),可用于小至0.2 x 0.2mm的二極管以及半導(dǎo)體芯片連接應(yīng)用。
典型的固化性能
治療時(shí)間30分鐘@ 150°C
CureTGA減肥,%3
存儲(chǔ)
將產(chǎn)品存放在未開(kāi)封的容器中,干燥處。儲(chǔ)存信息可能在產(chǎn)品容器標(biāo)簽上顯示。*佳儲(chǔ)存溫度:-40°C。 低于( - )40°C或以上( - )40°C以下的儲(chǔ)存可能會(huì)對(duì)產(chǎn)品性能產(chǎn)生不利影響。從容器中取出的物質(zhì)在使用過(guò)程中可能會(huì)受到污染。 不要將產(chǎn)品返回原來(lái)的容器。
ABLEBOND® 826-2® adhesive is designed for light emitting diode (LED) attach and can be used on diodes as small as 0.2 x 0.2mm, as well as semiconductor die attach applications.
TYPICAL CURING PERFORMANCE
Cure Schedule30 minutes @ 150°C
Weight Loss on CureTGA, % 3
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.Material removed from containers may be contaminated during use. Do not return product to the original container |
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