ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
ABLEBOND®8175A樂泰膠水,電子膠
技術服務熱線:021-51693135 / 021-22818476
ABLEBOND®8175A專為微電子互連應用中的焊料更換而設計。 該粘合劑可以與厚膜金屬化或傳統印刷電路板表面一起使用。 當使用不銹鋼篩網或金屬掩模模板打印時,它能夠分辨細間距分辨率(0.02英寸)。
典型的固化性能
治療時間表在150°C 3分鐘
替代治療時間表6分鐘@ 130°C
存儲
將產品存放在未開封的容器中,干燥處。存儲信息可能在產品容器標簽上顯示。*佳存儲:-40°C從容器中取出的物質在使用過程中可能會受到污染。 不要將產品返回原來的容器。
ABLEBOND® 8175A is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
TYPICAL CURING PERFORMANCE
Cure Schedule3 minutes @ 150°C
Alternative Cure Schedule6 minutes @ 130°C
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C Material removed from containers may be contaminated during use. Do not return product to the original container |
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