ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
ABLEBOND®84-1LMIT樂泰膠水,導電環氧樹脂粘合劑
技術服務熱線：021-51693135 / 021-22818476
ABLEBOND®84-1LMIT高導熱芯片貼附粘合劑Ablebond®84-1LMIT導電環氧樹脂粘合劑的導熱系數比其他填充銀的環氧樹脂高出三倍。這種高純度，低脫氣粘合劑滿足方法5011的固化2的供應商要求 小時在150°C。 對于方法5011進行測試時，請參見反面。結合84-1LMIT粘合劑無溶劑，使其適合通過注射器分配或絲網印刷（200目）進行應用。 注意：150℃下需要2小時固化以滿足所列的150℃下的模切需求。儲存壽命Ablebond 84-1LMIT粘合劑可在-40°C下儲存1年。
ABLEBOND® 84-1LMIT HIGH THERMAL CONDUCTIVITY CHIP ATTACH ADHESIVE Ablebond® 84-1LMIT electrically conductive epoxy adhesive exhibits a thermal conductivity three times higher than other silver filled epoxies.This high purity, low outgassing adhesive meets the supplier requirements of Method 5011 when cured 2 hours at 150°C. See reverse side for results when tested to Method 5011.Ablebond 84-1LMIT adhesive is solvent-free, making it suitable for application by syringe dispensing or screen printing (200-mesh). NOTE: A 2-hour cure at 150°C is necessary to meet the die shear requirement at 150°C as listed.STORAGE LIFE Ablebond 84-1LMIT adhesive may be stored up to 1 year at –40°C |
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