MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/MERSON & CUMING E1216電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
Product Description: E 1216 is a new, innovative capillary flow filled with CSP, BGA or flip chip device. E 1216 Design For the need for a large volume assembly operation the bottom fill flow is very fast, completely healing the length of a reflow oven, but is stable enough to easily transport, store and use large capacity cartridges (up to 20 ounces). E 1216 has an extraordinary working life and can be used in many production classes. E 1216 is specifically designed for the elimination of acid anhydrides for those who prefer to work with the type of curing agent and anhydride-free products.
Application: E 1216 is designed to improve the mechanical strength of the CSP and BGA devices, such as drop and bend tests, without reducing the thermal cycle performance inherent in the area array package itself. For Flip chip components, E 1216 greatly improves thermal cycling performance. Merge the properties of this innovative underfill It is the ideal candidate for large-capacity assembly of CSP and BGA or flip chip devices.
Cure Schedule: Treat any recommended treatment regimen. The cure schedule is "the time to cure the temperature to achieve complete cure of the product"; the times do not include the time required to raise the temperature to cure the temperature. Contacting an E & C technical service representative requires additional treatment options
產(chǎn)品描述 ： E 1216是一種新的，創(chuàng) |
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