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技術服務熱線：021-51693135 / 021-22818476
TECHNOMELT PA 646 high performance thermoplastic polyamide
is designed to meet low pressure molding process requirements. This
product can be processed at low processing pressure due to its low
viscosity, allowing encapsulation of fragile components without
damage. This material produces no toxic fumes in process and
provides a good balance of low and high temperature performance.
TECHNOMELT PA 646 is particularly suited to applications such as
computer connectors and memory sticks where high strength and
hardness are desired.
LIQUID-STATE TYPICAL PROPERTIES
Viscosity @ 225 °C, mPa∙s (cP) 4,500
Specific Gravity @ 25 °C 0.98
Softening Point, °C 170 to 180
TYPICAL PROCESS DATA
Handling:
Molding Temperature, °C 200 to 240
TECHNOMELT PA 646 has been formulated to provide the best
possible moldability and as wide a molding latitude as possible. Much
of the final molding parameters will be determined by the mold design.
Although molding and curing conditions will vary from situation to
situation, recommended starting ranges are shown above.
Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling. TECHNOMELT PA 646高性能熱塑性聚酰胺
旨在滿足低壓成型工藝要求。這個
產品可以在低加工壓力下進行處理，因為其低
粘度，允許無脆性組分的包封
損傷。這種材料在生產過程中不產生有毒的煙霧
提供良好的低溫和高溫性能平衡。
TECHNOMELT PA 646特別適用于諸如
電腦連接器和記憶棒，其強度高
需要硬度。
液態典型特性
粘度@ 225℃，mPa•s（cP）4,500
比重@ 25°C 0.98
軟化點，℃170至180
典型工藝數據
處理：
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