樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/樂(lè)泰 3523電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰®
3523™ is used to bond, seal or coat metal and
glass components in industrial applications. This product is
suitable for reinforcement of flexible PCB and for bonding a
wide range of materials. When cured, it offers excellent
flexibility and toughness, making it highly resistant to vibration
and impact forces.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.06
Refractive Index, ASTM D 1218 1.48
Flash Point - See MSDS
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 6, speed 20 rpm 16,000 to 24,000LMS
TYPICAL CURING PERFORMANCE
樂(lè)泰®
3523™ cures when exposed to UV radiation of 365
nm. To obtain full cure on surfaces exposed to air, radiation @
220 to 260 nm is also required. The speed of cure and depth of
cure will depend upon the UV intensity and spectral distribution
of the light source, the exposure time and the light
transmittance of the substrates. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties
樂(lè)泰®
3523™用于粘合，密封或涂上金屬和
玻璃組件在工業(yè)應(yīng)用中。這個(gè)產(chǎn)品是
適用于加強(qiáng)柔性PCB和粘接a
范圍廣泛的材料。治愈時(shí)，它提供優(yōu)秀
靈活性和韌性，使其具有高抗振性
和沖擊力。
固化材料的典型特性
比重@ 25°C 1.06
折射率ASTM D 1218 1.48
閃點(diǎn) - 參見(jiàn)MSDS
粘度，Brookfield - RVF，25℃，mPa•s（cP）：
主軸6，轉(zhuǎn)速20rpm 16,000至 |
 |
|
手機(jī)站
您當(dāng)前位置是：產(chǎn)品大全 >> 化工 >>
膠粘劑
免責(zé)聲明：以上所展示的信息由會(huì)員自行提供，內(nèi)容的真實(shí)性、準(zhǔn)確性和合法性由發(fā)布會(huì)員負(fù)責(zé)，www.qy6.com對(duì)此不承擔(dān)任何責(zé)任。如有侵犯您的權(quán)益，請(qǐng)來(lái)信通知?jiǎng)h除。
10
聯(lián)系信息
