HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/HYSOL US2350電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術服務熱線：021-51693135 / 021-22818476
HYSOL® US2350 is a flexible, flame retardant, mineral filled,
polyurethane compound. This potting compound has long pot
life, and is low viscosity so it flows well and adheres to many
substrates. It has very low odor and does not contain TDI or
mercury compounds.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties
Density, @ 23 °C, g/cm3 1.24
Viscosity, Brookfield - RVF, cP:
Spindle 2, speed 20 rpm 55
Part B Properties
Density, @ 23 °C, g/cm3 1.46
Viscosity, Brookfield - RVF, cP:
Spindle 5, speed 20 rpm 13,000
Mixed Properties
Working Time, 300 gm mass @ 23 °C, minutes 45
Gel Time, 300 gm mass @ 23 °C, minutes 90
Techne Gel, 140 gm mass, minutes 103
Viscosity, Brookfield - RVF, 23 °C, mPa•s (cP):
Spindle 2, speed 20 rpm 2,400
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
12 to 24 hours @ 23 °C (Recommended cure)
1 to 3 hours @ 23 °C (Alternate cure)
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Liquid Storage - Liquids should be stored at 23°C or
below, in closed containers. If stored below 23°C, the
material MUST be allowed to come to room temperature, in
the sealed container, to avoid moisture contamination. HYSOL®
US2350是一種柔性，阻燃，礦物填充，
聚氨酯化合物。這種灌封料長鍋
壽命低，粘度低，因此流動良好，粘附于許多
底物。它具有非常低的氣味，不含TDI或
汞化合物。
固化材料的典型特性
部分A屬性
密度，@ 23℃，g / cm 3 1.24
粘度，Brookfield - RVF，cP：
主軸2，轉速20轉55
B部分屬性
密度，@ 23℃，g / cm 3 1.46
粘度，Brookfield |
 |
|
手機站
您當前位置是：產(chǎn)品大全 >> 化工 >>
膠粘劑
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發(fā)布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。
10
聯(lián)系信息
