HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/HYSOL UF3800電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
UF3800 reworkable epoxy underfill is designed for CSP and
BGA applications. It cures quickly at moderate temperatures to
minimize stress to other components, and when cured provides
excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25°C, MPa
Physica MCR100,
Spindle CP50-1, 1000S-1
375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
Note: This is a bondline / material temperature.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion ppm/°C:
Below Tg, ppm/°C 52
Above Tg, ppm/°C 188
Glass Transition Temperature (Tg) by TMA, °C 69 Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -25 to -15°C. Storage below -25°C or
greater than -15°C can adversely affect product properties. UF3800可再循環環氧底層填料適用于CSP和
BGA應用。它能在適中的溫度下快速固化
*小化對其他部件的應力，并且在固化時提供
良好的焊接接頭機械應力保護。
固化材料的典型特性
粘度@ 25°C，MPa
Physica MCR100，
主軸CP50-1,1000S-1
375
比重1.13
25℃的天氣，第3天
保質期@ -20°C，月6
閃點 - 參見MSDS
典型的固化性能
治愈時間表
130°C時≥8分鐘
注意：這是一個粘合線/材料溫度。
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