HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/HYSOL QMI529HT電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
QMI 529HT is a highly silver filled, conductive adhesive
designed to provide high (6-7 W/m°K) thermal conductivity and
excellent electrical conductivity for attachment of integrated
circuits and components to metallic leadframes. The material
is hydrophobic and stable at high temperatures. These
features produce void-free bond lines with excellent adhesive
strength to a wide variety of metals and ceramic surfaces,
including copper, silver-plated copper, preplated leadframes
(NiPdAu) and Alloy 42. A package or device manufactured
with QMI 529HT will have high resistance to delamination and
popcorning after multiple exposures to lead-free solder reflow
temperatures. The QMI 529HT is designed to achieve UPHs
several orders of magnitude higher than conventional oven
cured adhesives. Maximum productivity is realized through inline
cure, either on the diebonder using a post diebond heater
or on the wirebonder preheater.
“This product and its use may be covered by patent 5,717,034 and by
one or more pending patent applications.”
TYPICAL APPLICATIONS
This product was developed as soft-solder replacement or for
applications that require higher thermal or high electrical
conductivity.
STORAGE AND HANDLING
QMI 529HT is supplied in syringes and should be stored at
-40°C. Please review 漢高’s current Die Attach Handling
Procedure for additional details on thawing and usage.
產品描述
QMI 529HT是一種高度充滿銀色的導電膠
旨在提供高（6-7 W / m°K）導熱性和
優良的導電性用于附件的集成
電路和組件到金屬引線框架。材料
在高溫下具有疏水性和穩定性。這些
特征產生具有優異粘合劑的無 |
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