EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/EMERSON & CUMING E1172A電子組裝/工業膠水/電子組裝膠水/工業用膠
技術服務熱線：021-51693135 / 021-22818476
Product Description: E 1172 A is the latest innovative capillary stream Emerson & Cuming's underfill. E 1172 A is a fast-flowing, fast-curing underfill. It is a component that acidifies the epoxy resin to enhance moisture resistance. This combination of innovative properties of the sealant makes it one of today's commercially available capillary underfill. Unlike similar products, E 1172 A is the highest part of the reliability of the high load matched low CTE solder. While E 1172 A in the low cure temperature (135 ° C), working abnormally long life resulted in a very consistent distribution of multiple production shifts
Application: E 1172 A is formulated for very fine pitch area array equipment, 25 is easily filled with filling equipment for micron geometry. It provides a uniform, free sealant layer that maximizes the temperature cycling capability of the array device through its special adhesion with all common stresses by separating the stress away from the solder distribution on the surface
產品描述：E 1172 A是Emerson＆Cuming*新創新的毛細管流化床底蓋。 E 1172 A是一種快速流動，快速固化的底部填充物。它是使環氧樹脂酸化以增強耐濕性的成分。這種密封劑的創新性能的組合使其成為當今商業可用的毛細管底層填料之一。與同類產品不同，E 1172A是高負載匹配低CTE焊料的可靠性的*高部分。雖然E 1172 A在低固化溫度（135°C）下，工作異常長壽命導致多個生產班次的非 |
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